Epoxy 4044 is delivered ready to use, and is available in
syringes, cartridges, and jars. When stencil printing, use a
clean stencil and apply epoxy to stencil in ½” diameter bead.
Bond strength will vary depending on component type,
adhesive dot size, cure and type of solder mask.
Uncured adhesive may be removed from the PCB with
isopropyl alcohol. Cured epoxy or removal of bonded
components can be accomplished with the application of heat
at 120°C (250°F) which will soften Epoxy 4044 to aid