REL61 is ideally suited for industries requiring a lower cost, enhanced durability alloy. It has repeatedly demonstrated reliability gains over SAC305 and other low/no silver alloys in thermal cycling performance, such as LED lighting, in-cabin automotive electronics, and high power applications. REL61 provides the electronics assembly marketplace a low cost alternative to SAC alloys that has the reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solder alloys. REL22 has also been developed to provide the most durable alloy option possible, with twice the durability of SAC305 in thermal cycling and mechanical performance. REL22 addresses production quality issues associated with similar alloys, including Sn/Ag/Bi/Sb/Ni/Cu, such as pin-holes on SMT solder joints and voiding on BTC components. Testing demonstrates that REL22 is well suited to extreme thermal exposure operating environments, such as under-hood automotive, avionics/aerospace, and other severe operating environments. The low creep rates exhibited by REL22 make it ideal for applications where normal shock, vibration, and high G-forces are experienced.