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AIM Solder Australia

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  • AIM Solder Paste Sn63/Pb37 No Clean Syringe

    SKU: 63NC254S

    $10.00 – $25.00
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    Solder Paste Sn63/Pb37 No Clean 10cc Pneumatic Syringe

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  • AIM Solder Paste Sn63/Pb37 NC257-2 T4 No Clean 89%

    SKU: 63NC257-2J

    $56.00 – $84.00
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    Made in Australia

    Ball Size: T4
    Flux Type: No Clean
    Flux Content: 11% / Metal Content 89%

     

    AIM NC257-2 Solder Paste improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. It prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.

    NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts.

     

    The thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in pillow.

     

    AIM Solder Paste Sn63/Pb37 NC257-2 No Clean 500g jar

     

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  • AIM Solder Paste Sn63/Pb37 M8 T4 No Clean 90% 500g jar

    SKU: 63M8J5

    $84.00
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    AIM Solder Paste Sn63/Pb37 M8 No Clean 500g jar

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  • AIM Solder Paste Sn62/Pb36/Ag2 T4 No Clean 89% 500g jar

    SKU: 62NC257-2J5

    $95.00
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    AIM NC257-2 Solder Paste improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. It prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.

     

    NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts.

     

    The thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in pillow.

     

    AIM Solder Paste Sn62/Pb36/Ag2 No Clean 500g jar

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  • AIM Solder Paste Sn62/Pb37 No Clean Cartridge

    SKU: 62NC257C5-T4

    $95.00
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    AIM NC257-2 Solder Paste improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. It prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.

     

    NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts.

     

    The thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in pillow.

     

    AIM Solder Paste Sn62/Pb36/Ag2 No Clean 500g cartridge

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  • AIM Lead Free SAC305 Solder Paste T4 No Clean

    SKU: SAC305NC257

    $78.00 – $111.00
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    AIM Solder Paste is made fresh in Australia

    T4 ball size for fine pitch applications

    AIM NC257-2 Solder Paste improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. It prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.

     

    NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts.

     

    The thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in pillow.

     

    Available in Jars and Cartridges
    250g Jars contain slightly more flux 13.5% than 500g Jars and Cartridges 12.5% flux

     

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  • AIM Lead Free SAC305 M8 Solder Paste T4 No Clean 88% 500g Jar

    SKU: SAC305M8J5

    $106.00
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    AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.

    Features:
    – Halogen-free
    – Low voiding on BGA and BTC components
    – REACH and RoHS compliant
    – For use with demanding, high density electronic assemblies
    – High SIR/Electrically safe residue
    – Formulated for use with T4 and finer powders
    – Mitigates head-in-pillow

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  • AIM Lead Free SAC305 Solder Paste T5 No Clean 88.0% 500g Jar

    SKU: SAC305NC257-2J5-T5

    $140.00
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    AIM SAC305 NC257-2 T5 Solder Paste improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. It prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.

     

    NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts.

     

    The thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in pillow.

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  • NC Tacky Rework Flux Gel 10cc Syringe

    SKU: NC-TAC2-S10-PT

    $15.00
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    NC Paste Flux is a no clean tacky/rework flux designed for general touch up or rework of printed circuit boards, and for BGA rework and sphere attachment. NC Paste Flux can be used for hand soldering, hot-air rework stations, convection reflow, or vapor phase soldering. Soldering residues do not require cleaning and are clear and inert. NC Paste Flux is compatible with all tin-lead and lead-free alloys. NC Paste Flux can be dispensed, brushed or stencil printed. NC Paste Flux complies with the IPC 7711-7721 standard

    AIM Flux Gel / Paste No Clean 10cc Syringe with Plunger

     

    AIM Flux Gel / Paste No Clean 10cc Syringe with Plunger

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  • Stencil Cleaner 20L

    Stencil Cleaner

    SKU: CT-SKM

    $18.80 – $218.30
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    Screen Kleen M is an effective and economical so cleaner, formulated to be completely compatible with all commonly used solder pastes. It offers a fast evaporation rate, and dries without leaving any residue. Unlike other hand applied stencil cleaners, Screen Kleen M helps to reduce solder paste dry-out while enhancing its release from even the finest apertures. This extends the on-screen life of the solder paste, allowing for a greater number of prints between cleaning.

     

    Screen Kleen M is chlorine-free and free of halogenated solvents. Its use will reduce the risk of print defects, such as smears and bridging, without interfering with the soldering process.

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  • AI-264-5-1L

    AIM Liquid Flux 264-5 Alcohol Based No Clean

    SKU: 264-5

    $26.40 – $244.50
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    Alcohol based liquid flux for rework, or production purposes in wave soldering (foam or spray) and selective soldering machines. 
    No Clean residues after heating
    Solids Content – 3.5% 

    No Clean 264-5 in an alcohol-based liquid flux formulated to offer a very wide process window for lead-free and tin-lead wave soldering operations. It is best suited for foam fluxers, offering fast wetting for SN100c and SAC alloys, and compatibility with a broad range of lead-free and tin-lead alloys. 264-5 offers low post-process residues, and has proven a reduction in preventative maintenance requirements for spray fluxing applications. It is designed to be a non-visible residue flux which can be cleaned if critical to the product application. Flux Thinners is commonly used with foam fluxers to prevent a high build-up of flux solids, and can be used with this product.

     

    AIM Liquid Flux 264-5 No Clean 1L

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  • AI-264-5-1L

    AIM Liquid Flux FX16 Alcohol Based No Clean

    SKU: FX16

    $37.25 – $74.50
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    Alcohol based liquid flux for rework, or production purposes in wave soldering (spray fluxer only) and ideal for selective soldering machines. 
    No Clean residues after heating
    Solids Content – 2.7% 

    FX16 is a sprayable no-clean flux which has been engineered to provide exceptional soldering performance with a broad process window, leaving minimal, electrically safe flux residues – even when unheated.

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  • AIM Liquid Flux 277 Water Based No Clean

    SKU: 277

    $36.90 – $294.80
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    Water based liquid flux for rework, or production purposes in wave soldering (spray fluxer) and selective soldering machines. 
    No Clean residues after heating
    Solids Content – 5.8% 

    No Clean 277 is a water-based VOC-free flux that performs reliably equal or superior to many alcohol-based fluxes. Being a medium-solids residue flux it has an exceptionally durable and powerful activator system, ideally suited for high thermal mass assemblies such as backplanes, power management, servers, and palletised assemblies, whilst also withstanding the high solder temperatures required for selective soldering. 277 can be used with all common lead-free wave soldering alloys, including tin-silver-copper, tin-silver, tin-copper, and others. Optimised for flux spray applications, it has been proven to reduce equipment maintenance. Remaining 277 residues may be cleaned only if critical to the product application.

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  • Solder Bar Sn63/Pb37 25kg

    SKU: 63/37-BAR

    $1,122.75
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    Sn63/Pb37 is a high purity alloy that is composed of 63% tin and 37% lead, and is alloyed in a proprietary method that results in a low drossing, high wet solder. This process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183 degrees (361 degrees fahrenheit). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection and as a base for soldering. This alloy is available in bar, solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot, and anode form.

     

    Solder Bar Sn63/Pb37 25 Kilo

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  • SN100C Lead Free Solder Bars 20kg

    SKU: SN100C-EXT-BAR

    $1,972.20
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    SN100C is a lead-free solder alloy developed by Nihon Superior in Japan. It offers user-friendly properties and has been proven in commercial production since 1999. The addition of nickel improves the wetting and flow properties of the cost effective tin-copper eutectic. This makes it possible to achieve excellent results in wave soldering at process temperatures comparable to the tin-lead solder it replaces. Performance in wave soldering at least matches that of more expensive silver-containing alloys, and the resulting joints are smoother and brighter.

     

    SN100C Lead Free Solder Bars 20kg

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  • SN100C Lead Free Solder Pellets 1kg

    SKU: SN100C-PELLETS

    $98.61
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    SN100C is a lead-free solder alloy developed by Nihon Superior in Japan. It offers user-friendly properties and has been proven in commercial production since 1999. The addition of nickel improves the wetting and flow properties of the cost effective tin-copper eutectic. This makes it possible to achieve excellent results in wave soldering at process temperatures comparable to the tin-lead solder it replaces. Performance in wave soldering at least matches that of more expensive silver-containing alloys, and the resulting joints are smoother and brighter.

     

    SN100C Lead Free Solder Pellets 1kg

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  • SAC305 / SN97C Lead Free Solder Bars 25kg

    SKU: SAC305-EXT-BAR

    $3,735.00
    0 out of 5

    SAC305 is a lead-free alloy that contains 96.5% tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, it offers far superior fluidity as compared to other alloys and other makes of solder bars, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. It is alloyed in the proprietary Electropure method that results in a low drossing, high wetting solder, thus improving flow and reducing bridging. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.

     

    SAC305 Lead Free Solder Bars 25kg

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  • Lead Free SN100C Solder Paste M8 T4 No Clean 88% 500g Jar

    SKU: SN100CM8J5

    $106.00
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    Lead Free SN100C Solder Paste 
    Flux Medium: M8
    Metal Content: 88%
    Flux Type: No Clean
    Ball Size: T4
    Packaging: 500g Jar

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  • Lead Free SN100C Solder Paste T4 No Clean 87.5% 500g Jar

    SKU: SN100CNC257-2J5

    $106.00
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    Lead Free SN100C Solder Paste No Clean 500g Jar

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  • Lead Free SAC305 Solder Paste WS488 Water Soluble 88% 250g Jar

    SKU: SAC305WS488J250

    $100.00
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    AIM WS488 Solder Paste has been developed in response to electronics manufacturers demanding an all-purpose, reliably consistent water-soluble solder paste. WS488 offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.

     

    WS488 can be used in fine pitch printing applications, and has proven effective in the assembly of 0201 components. It provides consistent printing characteristics and slump resistance during high-speed printing, while the excellent activity of WS488 makes it a suitable choice when soldering to standard to difficult-to-wet parts, including lead-free alloys and finishes. In addition, WS488 has proven to substantially reduce voiding under micro-BGAs, and is designed to avoid foaming during washing, even in high-pressure wash systems.

     

    Residues may be cleaned easily in straight water, with the result being exceptional electrical reliability.

     

    Lead Free SAC305 Solder Paste Water Soluble 250g Jar

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