Categories

AIM Solder Australia

1 2

  • Lead Free SAC305 Solder Paste WS488 Water Soluble 88% 250g Jar

    SKU: SAC305WS488J250

    $100.00
    0 out of 5

    AIM WS353 Solder Paste has been developed in response to electronics manufacturers demanding an all-purpose, reliably consistent water-soluble solder paste. WS353 offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.

     

    WS353 can be used in fine pitch printing applications, and has proven effective in the assembly of 0201 components. It provides consistent printing characteristics and slump resistance during high-speed printing, while the excellent activity of WS353 makes it a suitable choice when soldering to standard to difficult-to-wet parts, including lead-free alloys and finishes. In addition, WS353 has proven to substantially reduce voiding under micro-BGAs, and is designed to avoid foaming during washing, even in high-pressure wash systems.

     

    Residues may be cleaned easily in straight water, with the result being exceptional electrical reliability.

     

    Lead Free SAC305 Solder Paste Water Soluble 250g Jar

    Add to cart

  • Solder Paste Esky with Ice

    SKU: ESKY

    $6.00
    0 out of 5

    Esky with Ice for shipping of Solder Paste
    Will fit up to 12 x 500g jars per esky

    Add to cart

  • AIM Flux Gel / Paste No Clean 10cc Syringe with Plunger

    SKU: NC254S10-PT

    $15.00
    0 out of 5

    NC254 No Clean Flux Gel/ Paste is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. It may be used for general touch-up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages. Its superior wetting ability results in bright, smooth, skiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin-probed during in-circuit testing. NC254 is compatible with all tin-lead and lead-free alloys and may be brushed on, dispensed, pin transferred, or stencil printed.

     

    AIM Flux Gel / Paste No Clean 10cc Syringe with Plunger

    Add to cart

  • Mixing Spatula for Solder Paste

    SKU: OK-SPM154

    $11.60
    0 out of 5

    Colourful, hard to lose, easy to see handy spatula for mixing solder paste in jars.

     

    Available in assorted colours.

     

    Colour/s will be chosen random.

     

    Mixing Spatula for Solder Paste

    Add to cart

  • Leaded Solder Wire AIM Sn63/Pb37 CX18 No Clean

    SKU: 63-CX18

    $30.00 – $55.20
    0 out of 5

    AIM CX18 63/37 Leaded Solder Wire is a no clean flux core wire solder designed to offer excellent soldering results on all surface finishes. Engineered for high operator satisfaction CX18 is a low odor/smoke formula which promotes thermal transfer, and fast wetting without the need for additional flux. CX18 post solder residues are minimal, clear and pass IPC-004A and IPC-004B SIR and corrosion requirements.

    Select options

  • AIM Leaded Solder wire Sn63/Pb37 RMA

    SKU: 63-RMA

    $66.70 – $67.10
    0 out of 5

    AIM RMA 63/37 Leaded Solder Wire is a mildly activated, general-purpose wire solder for use in electronics soldering applications. RMA cored wire provides excellent tarnish and oxide removal producing shiny solder joints. RMA cored wire complies with MIL-F-14256 and QQ-S-571 specifications. RMA cored wire produces slight to moderate post process residues that may be left on the substrate or removed with commercially available flux removers.

    Select options
  • 202-25-1L

    Liquid Flux RMA 202-25

    SKU: 202-25

    $33.40 – $79.00
    0 out of 5

    Solids Content – 25% 
    RMA 202-25 Liquid Flux is an IPA-based, medium solids, mildly rosin activated flux which leaves a post-process residue that is insulating, non-hydroscopic, non-corrosive, and non-conductive.

    Select options
  • CT-RMA-15ML

    RMA 202-25 RMA Liquid Flux

    SKU: CT-RMA

    $7.40 – $8.30
    0 out of 5

    RMA 202-25 RMA Liquid Flux 15 mL brush

    Select options
  • WS735-1L

    Liquid Flux WS715M Water Soluble

    SKU: WS715M

    $42.20 – $101.10
    0 out of 5

    WS715M is an alcohol based, organically activated, rosin-free, water soluble liquid flux designed for wave, selective and rework solder applications.

    Select options

  • Flux Gel RMA 10cc

    SKU: RMA212

    $31.60
    0 out of 5

    Flux Gel RMA
    Available with plunger for hand applications or without plunger to be used in a pneumatic dispensing system.

    Select options

  • Flux Gel Water Soluble

    SKU: WS353S

    $40.00
    0 out of 5

    Flux Gel Water Soluble

    Available with plunger for hand applications or without plunger to be used in a pneumatic dispensing system.

    Select options
  • NC254J100

    Flux Gel / Paste No Clean 100g Jar

    SKU: NC254J100

    $117.10
    0 out of 5

    NC254 No Clean Flux Gel/ Paste is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. It may be used for general touch-up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages. Its superior wetting ability results in bright, smooth, skiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin-probed during in-circuit testing. NC254 is compatible with all tin-lead and lead-free alloys and may be brushed on, dispensed, pin transferred, or stencil printed.

     

    Flux Gel / Paste No Clean 100g Jar

    Add to cart
  • AI-4044-10CC-R

    Surface Mount Epoxy

    SKU: 4044

    $25.30 – $157.90
    0 out of 5

    Epoxy 4044 is single part epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. It is formulated to resist shear-thinning and has rapid thermal cure properties. Its viscosity and surface tension provide the tack force needed for use with high speed placement equipment.

     

    Epoxy 4044 offers excellent adhesion to metal, cermaics, and glass-filled epoxy surfaces, and is suitable for all open squeegee and enclosed head stencil printing systems.

     

    Visc: 600 – 1,000 Thix

    Boiling Point: >260 degrees celsius

    Tensile Strength: 11,500 psi

    Specific Gravity: 113

     

    Surface Mount Epoxy Red 10cc tube
    Replacement for SMA10SL

    Select options
1 2