No Clean 264-5 in an alcohol-based liquid flux formulated to offer a very wide process window for lead-free and tin-lead wave soldering operations. It is best suited for foam fluxers, offering fast wetting for SN100c and SAC alloys, and compatibility with a broad range of lead-free and tin-lead alloys. 264-5 offers low post-process residues, and has proven a reduction in preventative maintenance requirements for spray fluxing applications. It is designed to be a non-visible residue flux which can be cleaned if critical to the product application. Flux Thinners is commonly used with foam fluxers to prevent a high build-up of flux solids, and can be used with this product.