NC254J100

Flux Gel / Paste No Clean 100g Jar

SKU: NC254J100

NC254 No Clean Flux Gel/ Paste is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. It may be used for general touch-up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages. Its superior wetting ability results in bright, smooth, skiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin-probed during in-circuit testing. NC254 is compatible with all tin-lead and lead-free alloys and may be brushed on, dispensed, pin transferred, or stencil printed.

 

Flux Gel / Paste No Clean 100g Jar

$117.10

In stock

Description

NC254 No Clean Flux Gel/ Paste is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. It may be used for general touch-up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA) packages. Its superior wetting ability results in bright, smooth, skiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin-probed during in-circuit testing. NC254 is compatible with all tin-lead and lead-free alloys and may be brushed on, dispensed, pin transferred, or stencil printed.

 

Flux Gel / Paste No Clean 100g Jar

Additional information

Weight 0.2 kg
Dimensions 8 × 7 × 7 cm
Brands

Product Documents

Safety Data Sheet

Reviews

There are no reviews yet.

Be the first to review “Flux Gel / Paste No Clean 100g Jar”