Chemtools® R00 Silicone Free Heat Sink Compound is a white thermally conductive grease which is specially formulated for use in a silicone free environment, where silicone contamination may hurt solderability and increase solder defects. This non-crosslinked thermal compound does not dry out and is commonly used to improve heat flow between heat sinks and heat generating electronic devices such as LED’s, CPU’s and motors.
Heatsink Compound is designed to dissipate and efficiently transfer heat away from the heat generating component. It is a specifically formulated low bleed and low evaporation formula for use on applications where thermal transfer is required without electrical conductivity.
As a re-workable, removable, and non-toxic interface between heatsinks and heat sources, Heatsink Compound can be easily applied to quickly eliminate air gaps and safely maximise and aid the transfer of heat.