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RMA & Water Soluble
Lead Free SAC305 Solder Paste WS488 Water Soluble 88% 250g Jar
AIM WS353 Solder Paste has been developed in response to electronics manufacturers demanding an all-purpose, reliably consistent water-soluble solder paste. WS353 offers extended stencil life and tack time, robust environmental tolerance and printing characteristics, excellent activity, a broad cleaning process window, and compatibility with both tin-lead and lead-free solder alloys.
WS353 can be used in fine pitch printing applications, and has proven effective in the assembly of 0201 components. It provides consistent printing characteristics and slump resistance during high-speed printing, while the excellent activity of WS353 makes it a suitable choice when soldering to standard to difficult-to-wet parts, including lead-free alloys and finishes. In addition, WS353 has proven to substantially reduce voiding under micro-BGAs, and is designed to avoid foaming during washing, even in high-pressure wash systems.
Residues may be cleaned easily in straight water, with the result being exceptional electrical reliability.
Lead Free SAC305 Solder Paste Water Soluble 250g Jar
AIM SAC305 Solder Paste RMA258 Rosin Based 88% 500g Jar
AIM RMA258-15R Solder Paste has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. it reduces such defects as voiding, and eliminates head-in-pillow. Its superior wetting ability results in bright, smooth and shiny solder joints. RMA258-15R is capable of exceptional reflow during long, hot profiles, leaving medium, amber colored post-process residues.
Available in tin/lead and lead-free, including no and low-silver alloys.