No Clean

  • Solder Paste Lead Free SAC305 Syringe

    SKU: SAC305NC257-2S

    In stock

    $15.00$45.00
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    Dispensing grade lead free solder paste for surface mount loading and rework.  
    Ideal for small prototype jobs.
    Alloy: SAC305
    Ball Size: T4
    Flux Type: No Clean
    Made in Australia
    Available with plunger for hand applications or without plunger to be used in a pneumatic dispensing system.

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  • AIM Lead Free SAC305 Solder Paste T4 No Clean

    SKU: SAC305NC257

    In stock

    $78.00$111.00
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    AIM Solder Paste is made fresh in Australia

    T4 ball size for fine pitch applications

    AIM NC257-2 Solder Paste improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. It prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.

     

    NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts.

     

    The thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in pillow.

     

    Available in Jars and Cartridges
    250g Jars contain slightly more flux 13.5% than 500g Jars and Cartridges 12.5% flux

     

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  • AIM Lead Free SAC305 M8 Solder Paste T4 No Clean 88.5% 500g Jar

    SKU: SAC305M8J5

    In stock

    $106.00
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    AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity, residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.

    Features:
    – Halogen-free
    – Low voiding on BGA and BTC components
    – REACH and RoHS compliant
    – For use with demanding, high density electronic assemblies
    – High SIR/Electrically safe residue
    – Formulated for use with T4 and finer powders
    – Mitigates head-in-pillow

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  • AIM Lead Free SAC305 Solder Paste T5 No Clean 88.0% 500g Jar

    SKU: SAC305NC257-2J5-T5

    In stock

    $140.00
    0 out of 5

    AIM SAC305 NC257-2 T5 Solder Paste improves every aspect of leaded soldering, increasing the throughput of the most advanced SMT applications. It prints at high speeds without slumping and produces consistent print volumes, even for super fine-pitch applications.

     

    NC257-2 is unique in that it is halide-free and offers excellent wetting ability. This results not only in exceptional reliability, but also bright and shiny solder joints, excellent wetting angles and spread, and compatibility with difficult-to-solder parts.

     

    The thermal stability of NC257-2 has proven to eliminate the most challenging defects associated with lead-free SMT, including voiding and head-in pillow.

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  • Lead Free SN100C Solder Paste M8 T4 No Clean 88.5% 500g Jar

    SKU: SN100CM8J5

    In stock

    $106.00
    0 out of 5

    Lead Free SN100C Solder Paste 
    Flux Medium: M8
    Metal Content: 88.5%
    Flux Type: No Clean
    Ball Size: T4
    Packaging: 500g Jar

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  • Lead Free SN100C Solder Paste T4 No Clean 87.5% 500g Jar

    SKU: SN100CNC257-2J5

    In stock

    $106.00
    0 out of 5

    Lead Free SN100C Solder Paste No Clean 500g Jar

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